Lennart Sorensen wrote:
On Tue, Oct 04, 2005 at 01:53:54PM +0100, Luke Kenneth Casson Leighton wrote:
at 45nm the current leakage is so insane that the heat
dissipation, through the oxide layer which covers the chip,
ends up blowing the chip up.
Unless someone finds a way to reduce the leakage. It is worth a lot of
money to some companies to solve that problem after all.
That's one way, the other is to find a way to cool such a chip. I see
references to diamond substrate from time to time, good thermal
conductor. So are other carbon forms, Fullerines, etc.
Clearly reducing leakage is the optimal solution, "deal with the heat"
is the other.
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